How to Order Custom NTAG 223/224 DNA NFC Inlays for OEM Label Production

Introduction

For an OEM label manufacturer, ordering an NTAG 223 DNA or NTAG 224 DNA NFC inlay involves more than selecting a chip. The chip, antenna geometry, substrate, adhesive construction, inlay dimensions and roll layout must work together with the downstream printing, lamination, encoding and die-cutting process.

A custom NTAG DNA NFC inlay is a chip-and-antenna assembly supplied on a compatible carrier or inlay structure. It is an intermediate component, not necessarily a finished printable NFC label. Depending on the agreed construction, it may be supplied as a dry inlay or a wet inlay with an adhesive layer and release liner.

This guide explains what label converters and OEM buyers should define before requesting a quotation, approving samples or placing a bulk order. The chip-level specifications below are based on NXP product information; physical inlay and reel specifications must be confirmed against the approved project drawing and sample. For a broader introduction to the component itself, see What Is an RFID Inlay?.

Quick Answer: What Should You Specify Before Ordering?

Before requesting a quotation for custom NTAG 223/224 DNA NFC inlays, prepare these six items:

·Chip selection: NTAG 223 DNA or NTAG 224 DNA, including the required memory-protection and authentication configuration.

·Inlay construction: dry or wet inlay, substrate, adhesive, release liner and required thickness.

·Antenna and dimensions: antenna geometry, antenna size, overall inlay size, chip position and orientation.

·Converting requirements: sheet or roll supply, web width, roll length, core diameter, outside diameter, inlay pitch and unwind direction.

·Data and security: NDEF content, SUN configuration, serialization, UID handling and key-management responsibilities.

·Validation: sample quantity, target reader or encoder, acceptance criteria and tests on the intended label construction.

If some specifications are not yet defined, provide the label drawing, converting-machine details, target application and a reference sample. The supplier can then review the information and identify which dimensions or technical decisions still need confirmation.

1. Choose the Right Chip: NTAG 223 DNA or NTAG 224 DNA

Both NXP chips operate at 13.56 MHz and comply with ISO/IEC 14443-A and NFC Forum Type 2 Tag requirements. Both support AES-128-protected Secure Unique NFC (SUN) message authentication. The main procurement differences are user memory and the method available for protected memory access.

Choose NTAG 223 DNA when 144 bytes of user memory and 32-bit password protection meet the application requirements. Consider NTAG 224 DNA when the project needs 208 bytes of user memory or AES-128-based three-pass mutual authentication for protected data access. Both models share AES-128-protected SUN message authentication, so the decision should be based on the complete data and security design rather than the chip number alone.

The figures in this table describe the IC, not the completed inlay or label. The finished RF performance depends on the antenna design, substrate, nearby materials, label construction, reader and operating environment. For related chip-selection guidance, seeNTAG 223/224 DNA vs NTAG 213/215/216 andNTAG 223 DNA vs NTAG 224 DNA.

2. Confirm NDEF Encoding, SUN Settings and UID Handling

Before production, document what the NFC device should read and how the application will verify it. A simple NDEF URL, a variable-data record and a SUN-enabled dynamic message are different encoding requirements and should not be treated as interchangeable.

·NDEF structure: provide the required URI, text or other NDEF records, including any fixed and variable fields.

·SUN configuration: define whether dynamic authentication data is required and how the message will be verified by the application or backend.

·Protected memory: specify whether NTAG 223 DNA password protection or NTAG 224 DNA mutual authentication is required.

·Key responsibilities: agree which party provisions, stores, controls and uses cryptographic keys. Do not send secret keys through an ordinary unsecured RFQ or artwork email.

·Serialization: define the customer serial-number format, data file, encoding sequence and any database mapping requirements.

Important UID note: the 7-byte UID is programmed by NXP for each IC. Treat it as a fixed chip identifier to be read, checked or mapped to a customer record—not as a freely rewritable serial number. Customer-specific serial numbers and NDEF data should be specified separately.

A SUN-capable chip does not create a complete anti-counterfeiting platform by itself. The implementation also needs a defined verification process, protected key management, suitable software and operational rules for invalid or suspicious scans. SeeHow NTAG 223/224 DNA Enables Secure NFC Product Authenticationfor the broader authentication workflow.

3. Define the Inlay Construction

An NFC inlay generally combines an IC connected to an HF antenna on a substrate. For an OEM label project, the construction may also include an adhesive layer and release liner. Confirm the actual material stack-up in the approved drawing because thickness, bonding and RF behavior depend on the chosen construction.

Dry inlay or wet inlay?

A dry inlay is generally supplied without a pressure-sensitive adhesive backing. A wet inlay normally includes an adhesive layer and a release liner so it can be applied or incorporated into a label-converting process. Suppliers may use different construction terminology, so buyers should confirm the layer structure rather than rely on the label name alone.

Physical details to confirm

·Substrate: PET or another technically compatible material approved for the converting process.

·Antenna: HF/NFC antenna design, conductor material and geometry. The conductor and fabrication method should be confirmed for the actual project.

·IC position: chip location, orientation and antenna-to-chip connection area.

·Overall dimensions: antenna dimensions, inlay length and width, edge margins and any required tolerances.

·Adhesive and liner: adhesive type or performance requirements, liner material and release behavior, when applicable.

·Thickness: total construction thickness and any local thickness over the IC, as applicable.

Do not assume that a standard antenna, substrate or adhesive will work with every package or label face stock. A new shape, small antenna, metallic surface, liquid-filled package or unusual layer stack may require a separate RF and mechanical evaluation.

4. Validate Samples Before Bulk Production

Sample approval should represent the intended production construction as closely as possible. Testing a bare inlay may not predict the result after adhesive lamination, printing, die-cutting or application to the final package.

1. Visual and dimensional inspection: check inlay size, chip placement, antenna alignment, adhesive coverage, liner and thickness against the approved drawing.

2. Chip identification and data check: confirm the selected IC, read the UID and verify the agreed NDEF content and serialization rules.

3. Authentication check: test SUN verification or protected-memory access using the intended application, reader and key-management arrangement.

4. RF functionality: test representative samples with the target NFC phone or reader in the intended label construction and use environment.

5. Converting trial: run the sample through the actual printing, encoding, lamination and die-cutting process, where applicable.

6. Acceptance record: document the sample revision, test setup, acceptance criteria, deviations and approval before releasing bulk production.

Agree the test method and acceptance limits before testing. Do not rely on a generic read-distance statement or a chip-only specification as proof that the finished label will meet the project requirement. Environmental tests, such as temperature, humidity, chemical exposure or flexing, should be added only when the application requires them and the test conditions are defined.

5. Prepare a Complete RFQ for Custom NTAG DNA Inlays

A clear RFQ helps the supplier review feasibility and quote the correct construction. Send as much of the following information as is available:

·Chip: NTAG 223 DNA or NTAG 224 DNA; approved NXP IC requirement and quantity.

·Application: anti-counterfeit label, smart packaging, pharmaceutical or cosmetics packaging, electronics authentication, industrial identification or another defined use.

·Inlay drawing: antenna and inlay dimensions, chip position, orientation and tolerance requirements.

·Construction: dry or wet inlay, substrate, adhesive, release liner and thickness.

·Reel data: sheet or roll format, web width, roll length, core diameter, outside diameter, pitch and unwind direction.

·Converting: face stock, label dimensions, print process, die-cutting and lamination details.

·Data: NDEF records, variable data, serialization, SUN configuration, password or mutual-authentication requirements and key responsibilities.

·Validation: sample quantity, reader/encoder model, functional test requirements and acceptance criteria.

·Commercial details: target quantity, packaging, destination country and requested delivery window.

If the exact antenna design or reel layout is not available, provide the final label dimensions, converting-machine details and any reference inlay. Mark every unknown item clearly so it can be reviewed before a quotation or production drawing is finalized.

6. Typical OEM Applications

Custom NTAG 223/224 DNA inlays may be evaluated for label and packaging projects where dynamic NFC authentication or protected data access is part of the solution design. Typical areas include:

·Anti-counterfeit and product-authentication labels for brand-owner programs.

·Smart packaging for cosmetics, luxury goods and selected consumer products.

·Electronics labels for product identity, after-sales information or warranty workflows.

·Pharmaceutical and healthcare packaging where the complete application meets its applicable regulatory, safety and validation requirements.

·Industrial NFC labels for asset identification and traceability projects.

The NFC IC is only one component of the finished system. The label design, antenna performance, authentication software, key control and business process must be evaluated together.

Frequently Asked Questions

What is the difference between an NTAG 223/224 DNA inlay and a finished NFC label?

An inlay is the chip-and-antenna assembly on a carrier or inlay structure. A finished NFC label normally adds the required face stock, adhesive, liner, printing and finishing. The agreed construction depends on whether the buyer needs a dry inlay, wet inlay or a completed label.

Can NTAG 223 DNA and NTAG 224 DNA both support SUN authentication?

Yes. Both support AES-128-protected SUN message authentication. NTAG 223 DNA has 144 bytes of user memory and 32-bit password protection. NTAG 224 DNA has 208 bytes of user memory and supports AES-128-based three-pass mutual authentication for protected memory access.

Can I customize the UID of an NTAG DNA inlay?

The 7-byte UID is programmed by NXP for each IC and should be treated as a fixed identifier. A project can define how the UID is read or mapped to customer records, while customer serial numbers and NDEF data are specified separately.

Can custom NFC inlays be supplied in rolls?

Roll supply can be discussed as a project requirement. Confirm the web width, roll length, core diameter, maximum outside diameter, inlay pitch, web direction and unwind direction, then validate the reel on the intended converting or encoding equipment. The final format is subject to production confirmation.

What is the difference between a wet inlay and a dry inlay?

A dry inlay is generally supplied without an adhesive backing. A wet inlay normally includes adhesive and a release liner. Confirm the exact layer construction and thickness with the supplier because terminology and available constructions can vary.

Does the chip specification guarantee the finished label read range?

No. The chip data sheet does not define the RF performance of every finished label. Antenna geometry, substrate, label layers, nearby materials, reader and operating environment all influence the result. Test the approved sample in the intended construction.

What should be approved before mass production?

Approve the chip, antenna and inlay drawing, material stack-up, adhesive and liner, roll layout, encoding data, security configuration, visual criteria and functional test results. The approved sample and drawing should be revision-controlled.

Request a Quote for Custom NTAG 223/224 DNA NFC Inlays

Share your chip preference, label dimensions, inlay construction and reel requirements with Kaisere Technology. If your antenna or roll layout is still under development, send the final label drawing, target converting process and application details for a technical review. For a related finished-card format, see theNTAG 223/224 DNA NFC card product page; card specifications are different from inlay-only specifications.

For a project-specific quotation, include the estimated quantity, target delivery window, NDEF and security requirements, sample needs and destination country. Final material, antenna, roll format and production availability will be confirmed against the project specification.Request a Quote.

Related Kaisere Resources

·What Is an RFID Inlay? Definition, Components, Uses, Manufacturing

·NTAG 223/224 DNA Cards Manufacturer | Secure NFC Card Supplier

·How NTAG 223/224 DNA Enables Secure NFC Product Authentication

·NTAG 223/224 DNA vs NTAG 213/215/216: When Do You Need Secure NFC Authentication

·NTAG 223 DNA vs NTAG 224 DNA: Which Chip Should You Choose?

·Custom Waterproof RFID Tags & NFC Labels

·Contact Kaisere Technology

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