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Custom NTAG 223/224 DNA Cards & Tags | Ordering Guide

How to Order Custom NTAG 223/224 DNA Cards or Tags

Specifications, Encoding, and Bulk Production

Ordering custom NTAG 223 DNA or NTAG 224 DNA products involves more than choosing an NFC chip. Buyers should define the card or tag format, security requirements, NDEF data, physical construction, personalization, sample tests and production acceptance criteria before approving a bulk order.

View NTAG 223/224 DNA NFC card optionsorexplore custom NFC tags and labels.

1. Start with the Application and Product Format

First, decide what the NFC product needs to do and how it will be used. A portable card and an adhesive label may use the same chip family, but they do not share the same physical design requirements.

Format

Typical project fit

Information to confirm

NFC card

A portable credential or branded card used for product verification, staff workflows, customer engagement or project-specific authentication.

Card size, thickness, body material, antenna/inlay construction, printing, finishing, personalization and packaging.

NFC label or tag

A product- or package-attached NFC interaction point for product identity, smart packaging, brand protection or item identification.

Tag dimensions and shape, substrate, face material, adhesive, antenna layout, mounting surface, print method and environmental conditions.

For card projects, CR80 is a common reference format (85.5 × 54 mm), while custom dimensions can be reviewed. For label projects, the product surface and attachment method are especially important. Standard NFC labels should not be assumed to work directly on metal; an appropriate anti-metal construction and a representative sample test may be required.

Shenzhen Kaisere Technology’s published product information confirms NTAG 223/224 DNA card options. For a tag or label using one of these exact ICs, confirm the chip, antenna, dimensions, adhesive and construction during the quotation stage.

2. Select NTAG 223 DNA or NTAG 224 DNA

Both ICs operate at 13.56 MHz, comply with ISO/IEC 14443-A and NFC Forum Type 2 Tag requirements, and support AES-128-protected Secure Unique NFC (SUN) message authentication. The main selection differences are user memory and memory-access protection.

Chip-level specification

NTAG 223 DNA

NTAG 224 DNA

NXP product number

NT2H2331G0

NT2H2421G0

Operating frequency

13.56 MHz

13.56 MHz

RF communication standard

ISO/IEC 14443-A

ISO/IEC 14443-A

NFC Forum type

Type 2 Tag

Type 2 Tag

User memory

144 bytes

208 bytes

UID

7 bytes

7 bytes

Data rate

106 kbit/s

106 kbit/s

SUN message authentication

AES-128-protected CMAC

AES-128-protected CMAC

Memory-access protection

32-bit password protection

AES-128-based three-pass mutual authentication

Data retention

10 years (IC specification)

10 years (IC specification)

Write endurance

100,000 cycles (IC specification)

100,000 cycles (IC specification)

When to consider NTAG 223 DNA: the 144-byte user memory and password-based memory access protection meet the project’s data and access-control requirements.

When to consider NTAG 224 DNA: the project needs 208 bytes of user memory or AES-128-based three-pass mutual authentication for protected memory access.

Do not choose a chip only because one model number is higher. Confirm the required commands, reader support, application behavior and key-management process with the system owner. These are IC-level specifications; finished-card or finished-tag performance also depends on the antenna and physical construction.

3. Define the NDEF Data and Security Configuration

NDEF encoding and cryptographic authentication are related, but they are not the same task. NDEF defines how application data is structured for NFC Forum-compatible tags. A basic NDEF write may store a URL or other supported record; a SUN configuration adds dynamic authentication data that a compatible verification system must validate.

Information to provide for NDEF encoding

·The NDEF record type and intended content, such as a URI/URL or another supported record.

·The destination URL, domain and any project-specific path or parameter format.

·Whether all cards or tags use the same data or require unique serialised data.

·A data file and field-mapping rules for variable records, where applicable.

·Any read/write access settings, locking requirements and post-encoding verification steps.

Information to define for SUN authentication

In a configured SUN application, the IC can mirror fields such as its UID and an incremental NFC counter into the NDEF message and generate a cryptographic message authentication code (CMAC) protected by an AES-128 key. A verification application or backend checks the received data according to the project’s security design.

Before production, agree on the authentication workflow, key ownership, key provisioning method, access permissions, backend validation and responsibility for testing. Do not send production cryptographic keys through an ordinary public enquiry form or assume that standard NDEF URL encoding includes secure key provisioning. Whether factory-side key personalisation is available must be confirmed separately.

The chip is one part of the solution. It does not by itself provide a complete anti-counterfeiting platform, product database, verification website or security operations process.

4. Confirm the Physical Customisation

Card construction

For custom card orders, specify the required dimensions and thickness, then select a material and construction that can accommodate the antenna and IC. Material options listed for the card programme include PVC, PET, PETG, PC, ABS, Teslin, PLA, RPVC, paper, wood and bamboo. Availability depends on the chosen structure and must be confirmed for the project.

Printing and finish options may include offset, screen, digital, UV and anti-counterfeiting printing, together with glossy, matte, frosted, epoxy or brushed finishes. Confirm artwork size, colour references, print sides, surface treatment and any finishing restrictions before sampling.

Tag and label construction

For an NFC label or tag, provide a drawing or target dimensions, the attachment surface, required adhesive, substrate or face material, antenna/inlay constraints, print area and environmental conditions. If the product will be attached to metal, a standard NFC sticker may not be suitable. The intended construction should be evaluated with a sample on the actual surface.

Personalisation and packaging

Specify any logo, serial number, barcode, QR code, variable data, printed identification or custom packaging. If visible serial numbers must match electronic identifiers or backend records, provide the mapping rules and define how mismatches and rejected pieces will be handled.

5. Follow a Clear Ordering Process

1. Describe the application. Explain the product, user interaction, verification purpose and expected deployment environment.

2. Choose the format and IC. Select a card, tag or label format and specify NTAG 223 DNA or NTAG 224 DNA. Confirm the security features required by the application.

3. Prepare the technical specification. State dimensions, thickness, materials, antenna/inlay requirements, printing, finish, adhesive and packaging as applicable.

4. Define data and security responsibilities. Supply NDEF instructions, variable-data rules, access settings and the agreed SUN/key-management workflow. Identify the party responsible for backend verification.

5. Request a quotation and representative sample. Provide the quantity, artwork, target country and target delivery date. Confirm the sample reflects the intended production construction and data configuration.

6. Test and approve the sample. Check appearance, dimensions, chip identification, NDEF data, security behavior, read performance and compatibility with the intended phones or readers.

7. Approve the production specification. Freeze the chip model, approved artwork, data version, construction, acceptance criteria, packaging and order quantity before the bulk run.

6. Test Samples Before Bulk Production

A sample should represent the planned production item as closely as possible. Testing an unfinished inlay or a different material does not fully validate a final laminated card or converted label.

Test area

What to verify

Chip identity

Confirm the selected IC model and the agreed chip configuration.

NDEF data

Read the expected record, URL, variable data and formatting using the intended devices.

SUN verification

For projects using SUN, verify the dynamic fields and cryptographic result through the agreed test application or backend.

Protected memory access

For protected commands, test the configured password or mutual-authentication procedure with the project reader/software.

RF performance

Test tap/read behavior with the actual phones or readers and the final card/tag construction; define an agreed test method rather than relying on a generic range claim.

Physical quality

Check dimensions, thickness, print position, colour, finish, edges, adhesive and packaging against the approved sample.

Data reconciliation

For serialized orders, verify the data file, printed identifiers, encoded records and any backend mapping.

Set measurable acceptance criteria before approving the sample. For a security-sensitive project, include a documented pass/fail test for the required authentication flow—not only a successful NFC tap.

7. Plan Bulk Production and Quality Inspection

For NTAG 223/224 DNA card projects, the published Kaisere workflow lists chip inspection, inlay production, card manufacturing, printing, encoding and final inspection. The card quality-control description includes incoming chip checks, material checks, printing inspection, encoding verification and final sampling tests.

For tag and label projects, the exact process depends on the inlay, face material, adhesive and conversion method. The general RFID tag programme lists material inspection, inlay integration, printing and lamination, encoding, performance testing, quality inspection and shipment. Confirm the actual production route and inspection records for the selected NTAG DNA construction.

Bulk order planning should be based on the approved specification, artwork and data files. Production quantity, packaging, export destination and target delivery date should be stated in the request for quotation. Minimum order quantity, unit price and lead time are project-specific and should be quoted rather than assumed.

8. What to Include in Your RFQ

To help the supplier assess the project and prepare an accurate quotation, include the following information:

1. Product format: NFC card, NFC label or another tag construction.

2. Chip: NTAG 223 DNA or NTAG 224 DNA, if already specified.

3. Application: product authentication, brand protection, smart packaging, identification or another use case.

4. Quantity: sample quantity and estimated bulk order quantity.

5. Physical specification: dimensions, thickness, material, antenna/inlay, adhesive and mounting surface, as applicable.

6. Printing and personalisation: artwork, finish, serial numbers, barcodes, QR codes and packaging.

7. Encoding: NDEF structure, URL, data file, variable-data rules, access settings and locking requirements.

8. Security workflow: SUN requirements, authentication behavior, key ownership and backend verification responsibility. Do not attach secret keys to the initial public RFQ.

9. Compatibility: target smartphone models, NFC readers, software and test environment.

10. Delivery: destination country, required documentation and target delivery date.

Some project details may still be under development. In that case, share the application and existing system specification first so that the format and technical questions can be reviewed before finalising the order.

Ready to discuss a custom NTAG DNA project? Send your chip preference, card or tag format, quantity and encoding requirements to request a project-specific quotation.

Request a Quote for NTAG 223/224 DNA Cards· Discuss custom NFC tags and labels

Frequently Asked Questions

What is the difference between NTAG 223 DNA and NTAG 224 DNA?

NTAG 223 DNA has 144 bytes of user memory and supports 32-bit password protection for memory access. NTAG 224 DNA has 208 bytes of user memory and supports AES-128-based three-pass mutual authentication. Both support AES-128-protected SUN message authentication. Select the IC according to the required memory and security workflow.

Can NTAG 223/224 DNA be supplied as both cards and tags?

Card options are listed in the Kaisere NTAG 223/224 DNA card product range. Tag or label projects can be reviewed according to the required chip, antenna, dimensions, adhesive and construction. Confirm the exact NTAG DNA tag configuration before placing an order.

Can NDEF data be encoded before shipment?

NDEF encoding can be specified as part of the order. Provide the required record type, URL or data, variable-data rules and access settings. SUN key personalisation and backend verification are separate security-workflow decisions and must be agreed with the responsible parties.

Does NTAG DNA automatically provide a complete anti-counterfeiting system?

No. SUN provides cryptographic message-authentication data at the IC level. A complete product-authentication workflow also needs appropriate key management, a verification application or backend, business rules and operational controls.

Will every NFC-enabled smartphone support the required function?

Both ICs use NFC Forum Type 2 Tag technology, but the user experience depends on the phone, operating system, application and configured security function. Test the exact devices and software expected in the deployment, especially where SUN verification or protected memory access is required.

Can an NTAG DNA label be placed directly on a metal product?

Do not assume that a standard NFC label will work on metal. Metal can affect antenna performance. Specify the mounting surface and evaluate a suitable anti-metal construction with a representative sample.

What is the MOQ and production lead time?

MOQ and lead time depend on the chip, format, material, printing, encoding, quantity, sample approval and production schedule. Provide the complete specification and destination country to receive a project-specific quotation.

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