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RFID Prelam Inlay: Components of an RFID Card Prelam Inlay

RFID Prelam Inlay: Components of an RFID Card Prelam Inlay

What is an RFID Prelam Inlay and How Does It Work?

An RFID prelam inlay is the core electronic insert for an RFID smart card. It consists of a patterned metal antenna connected to a tiny integrated circuit (IC) chip, all bonded onto a flexible substrate and often sandwiched between protective layers. This prelam inlay is laminated into thicker plastic sheets to form finished cards (like access or payment cards) or labels. When a reader’s radio waves power the inlay’s antenna, the antenna inductively or magnetically energizes the chip, which then transmits its stored ID/data back to the reader. In practice, companies like Kaisere Technology offer prelam sheets in standard formats, supporting popular chip series (NXP NTAG, MIFARE, Impinj UCODE, etc.) for seamless card production.

Key Function: The antenna must resonate at the operating frequency (e.g. 13.56 MHz for HF cards) so that it captures energy from the reader and powers the IC. The IC chip holds data (from a few hundred bytes in NFC tags to several kilobytes in secure cards) and performs modulation/demodulation. Prelam inlays are tested for antenna continuity and chip function before lamination. In card manufacturing, the prelam is placed between PVC or PET layers and pressed under heat and pressure, fusing the assembly into a rigid card.

What Are the Main Components of an RFID Prelam Inlay?

A typical prelam inlay comprises two electrical components – the antenna and the IC chip – plus physical materials holding them together.

   ●Antenna: Usually a planar loop or meandering coil patterned from a metal (commonly copper or aluminum) on the substrate. The antenna design (shape, number of turns) determines the inductance and ultimately the resonant frequency.

   ●IC Chip: A silicon RFID transponder die in a tiny package (often flip-chip bonded to the antenna) that stores data and performs RF communication. Chips vary by frequency band and application (e.g. HF chips like NXP MIFARE Classic, HF Vicinity (ISO15693), and UHF chips like Impinj Monza).

   ●Substrate: A thin insulating layer (paper, PET, PI, etc.) that supports the metal antenna. Flexible polymers like PET (Polyethylene Terephthalate) or polyimide are common substrates due to their durability and stability. In prelam cards, the substrate itself may be a sheet of PVC or PET sheet onto which the antenna/chip assembly is laminated.

   ●Adhesive Layers: Depending on design, adhesives may secure the antenna to the substrate or attach the inlay to the card layers. For chip bonding, conductive anisotropic adhesives (ACP) are often used to attach the chip to the antenna pads without shorting horizontal traces. Release liners or support layers (like Ahlstrom’s Optilam) protect the inlay during lamination.

   ●Protective Layers: Prelam inlays often include extra thin polymer films or “encapsulation” layers that protect the delicate electronics from moisture, abrasion, and ESD. For example, Metalcraft notes that after assembly, inlays are encased in durable polymers (PVC or PET) to shield them from environmental stress. These layers also smooth the surface for later printing.

Subtle variations exist: for instance, wet inlays include a pressure-sensitive adhesive and liner so they can be stuck into labels, while dry inlays omit the adhesive and rely on lamination into cards or laminates.

What Antenna Materials and Patterns Are Used in Prelam Inlays?

RFID antenna materials affect performance and cost. Copper is the most common antenna material due to its excellent conductivity (high signal strength). Copper antennas are typically produced by chemical etching of copper foil laminated on PET, or by laser etching a copper layer. Aluminum is a cheaper alternative: it has lower conductivity (slightly reduced read range) but is lightweight and widely used for cost-sensitive tags. Thin Aluminum foil stamping onto PET is common for high-volume inlays.

Silver ink (conductive paste) is used for printed antennas when flexible or cost-effective antennas are needed (for disposable tags or textile labels). Silver-printed antennas sacrifice some performance but can be applied by roll-to-roll printing or screen printing directly on paper or PET. Emerging materials include graphene and conductive polymers: graphene’s ultra-high conductivity and flexibility (demonstrated in research) promise lightweight antennas with minimal signal loss. Conductive polymers (e.g. PEDOT) enable printing very flexible antennas into textiles or biodegradable substrates.

Antenna patterns typically use spiral or rectangular meander loops tuned to the frequency: HF card antennas are often roughly rectangular loops with inward turns; UHF inlays use larger multi-turn “squiggle” or meander patterns (see image below for a UHF antenna example). More turns or longer conductors increase inductance, allowing the antenna to resonate at a lower frequency. Modern UHF ICs (e.g. Impinj Monza R6) even include AutoTune features that adapt the antenna’s tuning dynamically, improving read range despite environmental detuning.

Table 1 (below) compares antenna materials by frequency range, conductivity (affecting sensitivity), substrate compatibility, and typical use-cases:

MaterialFrequency BandsConductivity/SensitivitySubstrate CompatibilityTypical Use-Cases

Copper (Etched)

LF/HF/UHF

Very high (excellent read range)

PET, PI, PVC, paper

Durable cards (access, payment), general tags

Aluminum (Etched/Foil)

LF/HF/UHF

Good (lower than copper)

PET, PVC, paper

High-volume labels (retail, library), low-cost tags

Silver Ink (Printed)

HF/UHF

Moderate (lower range)

PET, paper, fabric

Wearable tags, printed labels, disposable inlays

Conductive Polymers

HF/UHF (research-use)

Variable (improving)

PET, paper, textile

Smart packaging, anti-counterfeit tags (experimental)

Graphene (Printed)

HF/UHF (R&D)

Theoretical ultrahigh

Flexible substrates

Future wearable RFID (research stage)


What RFID IC/Chip Types and Specifications Are Used in Prelam Inlays?

RFID inlays use specialized IC chips matching the frequency and application. Common examples include:

   ●LF (125–134 kHz) chips: e.g. EM4100/EM4200, T5577, Hitag1/2. These have simple memory (typically 128–330 bits) and short read ranges (up to ~10 cm). They power commonly animal ID, access tokens, and anti-theft tags. Packaging is usually a bare die or small SMD module.

   ●HF (13.56 MHz) chips:

       ○NFC Forum Type 2 chips like NXP NTAG21x (NTAG213/215/216) – typically 144–888 bytes user memory.

       ○MIFARE Classic 1K/4K – 1024 or 4096 bytes, ISO14443A, used in access/transit cards (little encryption beyond simple keys).

       ○MIFARE DESFire (EV1/EV2/EV3) – secure multi-application chips with 2–8 KB memory, AES/DES encryption (used in payment and secure ID).

       ○ICODE/Tag-it (ISO15693) – high-memory chips (up to several KB), longer range HF (e-passports, library systems).

       ○ST25TV series, Sony FeliCa, others – various features (e.g. tamper detection, high-speed for NFC).

   ●UHF (860–960 MHz) RAIN RFID chips:

       ○Impinj Monza series (Monza 4, 5, 6, 7, etc.) – EPCglobal Gen2 chips with 96–128-bit EPC memory and some user memory (32–512 bits), read sensitivity around –20 dBm enabling reads beyond 5 m.

       ○NXP UCODE® (EPC Gen2) series – similar, optimized for supply chain.

       ○Alien Higgs series – e.g. Higgs-3 with 800 bits total (up to 512 user bits) and very high sensitivity (operating ranges ~10 m).

       ○STMicroelectronics (ST UHF) chips, Broadcom, etc.

These chips differ in packaging (bare die vs wafer-level chip-scale). Prelam inlays usually require a chip in ultra-flat SMD or decapsulated form. For example, NXP’s NTAG21x have very thin chips (as low as 75 µm) for easy embedding. Table 2 (below) compares five representative chips:

Chip (Example)FrequencySensitivity/RangeMemory / SecuritySubstrate Card TypeTypical Use-Cases

NXP MIFARE Classic 1K

HF 13.56 MHz (ISO14443A)

Moderate (~–20 dBm, ~10 cm range)

1 KB EEPROM, 16 sectors; simple CRYPTO1

PVC credit cards

Access control, transit tickets

NXP NTAG213 (Type 2)

HF 13.56 MHz

Moderate (–18 dBm)

144 bytes user + OTP; I²C interface option

Stickers, labels, cards

NFC tags for consumer engagement, single-use authentication

NXP ICODE SLIX2

HF 13.56 MHz (ISO15693)

High (longer HF range)

1–2 KB; optional encryption, DDR memory

Smart posters, asset tags

e-Archive, library systems, high-memory HF tags

Impinj Monza R6

UHF 860–960 MHz (EPC Gen2)

–22.1 dBm R/W sensitivities (~6–9 m)

EPC 96 bit, no user mem; 50 yrs retention

UHF inlay labels

Apparel retail, inventory, baggage tags

Alien Higgs-3

UHF 860–960 MHz

–22.5 dBm read (class-leading) (Range ~10 m)

96–480 bit EPC; up to 512 bit user; 64-bit TID

UHF inlay labels

Retail, logistics; brand protection via DynamicAuth™


What Substrates and Adhesives Are Used?

The substrate is the carrier material for the inlay. Common substrates include:

   ●PET (Polyethylene Terephthalate): A plastic film (~50–100 µm) used in most inlay backings for labels and cards. PET offers good durability and stable dielectric properties.

   ●PVC: Often used in prelam sheets (e.g. Fudan F08 prelam) where the antenna is pre-bonded onto PVC cardstock. After lamination, the entire card is PVC..

   ●Paper: Used for low-cost tags and wristbands. Less durable but cheap; paper substrates are common in event/retail tags.

   ●Polyimide (PI, Kapton): High-temperature, chemically resistant film for industrial tags.

   ●Composite/Biodegradable: Some inlays use cellulose-based or wooden laminates (e.g. certified wood veneer) to meet sustainability goals.

Substrate thickness must be tightly controlled. For ID-1 cards (ISO 7810: 85.6×54×0.76 mm), the tolerances are on the order of ±0.5 mm. The inlay stack itself is very thin (typically 50–80 µm of copper plus adhesive layers). Deviations in substrate thickness or flatness can detune the antenna.

Adhesives: Chip-to-antenna bonding commonly uses anisotropic conductive adhesives (ACP) or epoxies. These adhesives have conductive particles and conduct electricity only through the thickness (Z-axis), creating solder-like connections. Adhesives must cure without damaging the chip or antenna. For lamination into cards, thermoplastic adhesives or pre-coated resin layers on PVC do the bonding – for example, PVC card lamination relies on heat-activated PVC resin or polyurethane (PUR) adhesives to fuse the layers. Release liners (like Ahlstrom’s antistatic Optilam) prevent sticking during lamination and protect the inlay from contamination and ESD.

How Are RFID Antennas Patterned and Tuned?

Antenna patterning methods include:

   ●Chemical Etching: Most precise, involves coating a metal layer on substrate and using photolithography/chemicals to remove unwanted copper or aluminum, leaving the antenna trace.

   ●Printing: Conductive inks (silver or carbon-based) are screen- or inkjet-printed onto the substrate for low-cost runs.

   ●Foil Stamping: Metal foils (aluminum) are stamped and laminated onto substrates.

   ●Wound Wire (LF only): For low-frequency tags, thin copper wires can be mechanically wound into coils on the substrate.

Antenna tuning is crucial. An RFID antenna must resonate at its operating frequency for maximum range. This is done by adjusting its electrical length (inductance) and/or adding capacitance. For example, an HF card antenna is tuned to 13.56 MHz by designing the coil’s inductance (L) and using the chip’s internal capacitance. Matching to the chip’s tuning capacitance maximizes power transfer. Tunable antenna features: modern ICs like Impinj’s Monza R6 have AutoTune which actively adjusts to optimize read range in situ. Physically, extra “T-shaped” tuning stubs or gaps in the coil can fine-tune the resonance during prototyping.

In practice, designers measure the antenna impedance (e.g. with a network analyzer) and add the appropriate tuning capacitor (or rely on the chip’s internal capacitance) so the assembled coil+capacitor resonates at e.g. 13.56 MHz. For UHF, simple parallel resonant tuning is less practical; instead, antenna dimensions and matching components (sometimes built into the IC) determine the center frequency.

How Are Prelam Inlays Manufactured?

The manufacturing process for a prelam inlay involves multiple precise steps.

   ●Substrate Prep: Start with base films (e.g. PET). For card inlays, multiple PET or PVC layers may already be laminated together (e.g. an RFID “prelam” sheet containing security laminates).

   ●Antenna Fabrication: Use etching, printing or wire-winding to create the antenna pattern on the substrate.

   ●Chip Attachment: Place and bond the RFID IC onto the antenna pads via flip-chip or strap bonding. Anisotropic conductive adhesive cures under heat/UV, making z-axis electrical connections.

   ●Sheet Testing: Entire substrate sheets (before cutting) are tested with specialized RFID readers or network analyzers to verify each antenna and chip.

   ●Lamination: Layers (e.g. PVC overlays) are aligned and hot-pressed. Custom release films (e.g. cellulose-based Optilam) may be used to protect the inlay. Conditions: typically ~150 °C and 4–10 bar pressure for 20+ minutes (card-specific).

   ●Cutting: The laminated stack is die-cut or laser-cut into individual card or label inlays.

   ●Final Testing: Each cut piece is tested again (RF read/write) to catch any damage from cutting.

   ●Inspection & Packaging: Visual QC for defects (bubbles, delam, marks) and counting into reels/sheets. Anti-static and moisture-barrier packaging is used for protection.

In large factories, this flow is highly automated. All processes have tolerances: for example, antenna etch width must be controlled (±10–20 µm) to ensure resonant frequency accuracy.

How Are Prelam Inlays Laminated into Cards?

The lamination step binds the inlay within a final card. This uses a hot lamination press with multiple layers. A typical ID-1 smart card may consist of: PVC core – prelam inlay – PVC overlay. Under 4–8 MPa pressure and 150–160 °C (approx. 300–320 °F) for ~20 minutes, the PVC layers soften and fuse around the inlay. Release films (like Ahlstrom Optilam™) separate the inlay from the press platens and prevent smearing.

Proper lamination is critical. Errors in lamination cause defects: insufficient pressure/heat leads to delamination (blisters), too much can deform the inlay or chip. Deviations can crush the chip, break antenna traces, or cause hotspots. For example, faulty lamination is cited as causing “bubbles, delamination, or crushed chips” if conditions deviate. High-quality manufacturers use temperature and pressure profiles carefully and sometimes inert atmospheres.

The release liner Optilam™ (Ahlstrom) exemplifies an improvement: it uses a cellulose fiber composite that withstands lamination heat/pressure and is antistatic to prevent ESD damage during lamination. After lamination, cards are cooled and ejected, ready for personalization (printing, encoding).

What Security Features Do RFID Inlays Support?

Even though a prelam inlay is raw hardware, it still embeds security features in hardware via the chip. Common security elements include:

   ●Unique IDs: Most RFID chips have a factory-programmed unalterable serial number (UID or TID) burned into hardware (e.g. 7-byte UID in NTAG, 64-bit UID in many UHF chips). This ensures each tag is unique.

   ●Password Protection: Chips (HF and UHF) often support 32-bit or larger access/killing passwords that restrict reading/writing. For instance, UHF Monza chips have 32-bit access and kill passwords, and NTAG supports a password-lock feature.

   ●Encryption & Authentication: More advanced ICs implement cryptography. MIFARE DESFire (AES) and NTAG21x (AES-128 Optionally) can encrypt data payloads. Some chips include digital signature capabilities: e.g. NTAG 21x’s originality signature (for product authentication) or Alien Higgs’ Dynamic Authentication™ (physical tag fingerprint).

   ●Tamper Detection: Certain HF chips include tamper flags. NXP NTAG also makes a TagTamper variant which detects when packaging is opened (used in medicine packaging).

   ●Kill Commands: UHF tags implement the Gen2 “kill” command that permanently disables the tag if needed (via kill password).

   ●Physical Design: Prelam inlays themselves can have security: chips are sandwiched deeply so they can’t be easily probed, and any delamination is evident. Advanced inlays may use ground or ferrite backing for anti-metal and to avoid covert modifications.

Together, these features mean a finished card has cryptographic protection and traceability by default. The inlay manufacturer must ensure these features function (via testing) and meet standards like EMV (for payment cards) or NXP’s SAM interface (for MIFARE).

What Standards Must Prelam Inlays Comply With?

Prelam inlays (and finished cards) must comply with several standards:

   ●ISO/IEC 7810 – defines card size (ID-1 format 85.6×54 mm) and mechanical tolerances (±0.5 mm overall)[36].

   ●ISO/IEC 14443 – for HF contactless cards (Type A/B, 13.56 MHz). Many chips (MIFARE, NTAG) conform to 14443A.

   ●ISO/IEC 15693 – for vicinity HF cards (longer range 13.56 MHz). ICODE chips follow ISO15693.

   ●ISO/IEC 18000-3 – HF RFID air interface. (ISO18000-3 Mode 1 is essentially ISO15693; Mode 2 is related to NFC/ISO14443).

   ●ISO/IEC 18000-6C (EPC Gen2) – for UHF tags (860–960 MHz). All commercial UHF chips (Impinj Monza, Alien, UCODE) implement this standard.

   ●ISO/IEC 7816 – if the card has a contact interface. (Not directly a concern for pure prelam inlays).

   ●RoHS/REACH/WEEE – environmental compliance for materials (lead-free finishes, no hazardous substances).

   ●Quality Standards: Some manufacturers follow ISO 9001, ISO 24787 (for inlay quality), or industry certification like ARC (Auburn RFID Lab) for performance benchmarking.

Meeting these standards often requires testing and certification. For example, UHF inlays are tested against EPCglobal Gen2 test suites. HF prelam inlays must pass compliance testing (e.g. FeliCa Certification for certain chips).

What Manufacturing Tolerances and Failure Modes Are Common?

Tolerances:

   ●Dimensions: Card layers must meet ISO7810 tolerances (~85.60×53.98 mm ±0.5 mm). Inlay layer thickness (~50–80 µm) is tiny, so placement accuracy is ±0.1 mm or better to ensure no stress. Antenna trace width tolerance is typically ±10–20 µm in etching.

   ●Alignment: The chip must be placed within ~100 µm of its designated pad location. Misalignment can cause bonding failures.

   ●Etch uniformity: Antenna conductor thickness (~18–35 µm copper) must be consistent to avoid Q-factor variation.

Failure Modes: Common defects include:

   ●Delamination: Layers separating due to poor lamination or moisture. Prelam inlays with integrated pre-lamination (e.g. Fudan F08) avoid this.

   ●Open Circuits: Broken antenna traces from handling or lamination stress. This yields dead tags. Manufacturers inspect to catch “antenna open circuits”.

   ●Bad Bonds: Chip cold-solder or adhesive failures, causing intermittent contact or open. Chip bond faults (cold joints) are identified by QC checks.

   ●Chip Failure: ESD or overheating during lamination can kill the chip. Release papers (Optilam) prevent ESD. High lamination temp can degrade chip adhesives.

   ●Shorts: Conductive debris or over-compression causing short between antenna turns or pads.

   ●Antenna detuning: Using a wrong laminate thickness can shift the resonance off-frequency, reducing read range.

   ●Corrosion: If exposed to water or humidity, metallic antennas can corrode (particularly if adhesives are hygroscopic).

Manufacturers mitigate these by robust QC. High-end lines use inline RF testers to check each inlay’s response.

What Is the Lifecycle and Environmental Impact of RFID Prelam Inlays?

Durability: Passive RFID inlays can last decades. Many chips retain data for >10–20 years under normal conditions. For instance, Impinj Monza R6 chips guarantee 50-year data retention and ~100k write cycles. NXP NTAG21x chips cite >10-year retention and the option to write thousands of times. Real-world lifespan is usually limited by physical wear rather than chip life.

Temperature/Humidity: Prelam cards typically operate from -20 to +60 °C (Zhanfeng notes their HF inlays work from -20°C to +60°C). Automotive or industrial inlays (IMMO tags) may use special chips rated to 85–125 °C. Substrates and adhesives must survive intended range. Humidity and UV can degrade polymers over years; most inlays are sealed to be waterproof.

Environmental: Traditional PVC cards create plastic waste. Recent efforts use sustainable substrates (wood veneers, paper, biodegradable polymers) to reduce waste. However, new materials must still meet tolerance and RF transparency requirements (wood can warp). Eco-friendly RFID inlays remain an active area (Kaisere even lists biodegradable prelams). All materials must comply with RoHS/REACH, and companies implement recycling programs for expired cards.

Lifecycle: Inlays are rated for many decades of shelf life (unpowered). Factors like temperature cycling or chemical exposure can slowly degrade adhesives or oxidize metals. Most data: Passive RFID can function 10–20+ years if undamaged. Active tags with batteries are shorter-lived (3–5 years).

What Are Typical Applications of Prelam Inlays?

RFID prelam inlays are used wherever laminated smart cards or labels are needed. Common applications include:

   ●Access and ID Cards: Employee badges, transit passes, hotel keycards (HF at 13.56 MHz). For example, Kaisere and others supply “prelam sheets” for contactless credit-card format credentials.

   ●Payment and Loyalty Cards: MIFARE/DESFire inlays in payment or membership cards.

   ●Library/Campus/Transport Cards: Using NFC/HF inlays for e-passports, library books, transit.

   ●Retail Apparel Tags: UHF inlay on a label (wet/dry inlay) for inventory, RFID-enabled shopping (Impinj/Alien inlays).

   ●Logistics and Asset Tracking: UHF labels on cartons/pallets (long-range).

   ●Animal and Healthcare Tags: LF/HF inlays in wristbands or ear tags, often in wet inlay form.

   ●Industrial Tags: Metal-mount or on-metal tags use special inlays built into rugged housings.

   ●Smart Packaging: NFC inlays on labels for authentication or interactivity.

   ●Industry-Specific: Anti-counterfeiting seals, RFID-enabled tickets.

Each application chooses frequency and materials accordingly: e.g. contactless smartcards use high-quality PVC prelam cards, while retail uses cheap adhesive paper inlays. Inlays are sold in high volumes for retail tags; card inlays are sold as standard-size sheets or rolls for card manufacturers.

FAQ (Frequently Asked Questions)

What is the difference between an RFID inlay, label, and tag?
An inlay is the raw antenna + chip assembly (on a substrate). A label is an inlay with a printable face sheet and adhesive (for sticking). A tag often means a finished unit (possibly ruggedized) with inlay inside a protective housing.

What frequencies do RFID prelam inlays support?
Prelam inlays cover LF (125/134 kHz), HF (13.56 MHz), and UHF (860–960 MHz). Each band uses different antenna sizes. Many suppliers offer tri-frequency inlays embedding multiple chips/antennas. Kaisere’s product lines, for example, include dual- and tri-band prelam designs.

How is antenna tuning achieved in an HF inlay?
By adjusting the coil inductance and adding a tuning capacitance so the LC circuit resonates at 13.56 MHz. The chip’s internal tuning capacitor (often ~10–30 pF) and an optional external capacitor form a resonator with the antenna inductance. Proper tuning maximizes read range.

What adhesives are used to bond the chip to the inlay?
Typically anisotropic conductive adhesives (ACP) are used. These z-axis conductive pastes contain metal particles so they conduct electricity vertically between the chip pads and antenna pads, while insulating in-plane. Epoxy or solder may be used in some high-volume lines.

What environmental conditions can an RFID inlay endure?
Standard PVC inlays typically handle -20°C to +60°C and operate in humid conditions (sealed design). Industrial inlays (for vehicles, outdoor use) use extended-temp chips (-40°C to +85°C) and robust substrates. Over time, extreme environments (UV, salt spray) can degrade materials. Passive inlays are generally waterproof once laminated.

How long do RFID prelam inlays retain data?
RFID chips use non-volatile EEPROM. Data retention is typically 10–20 years or more. For instance, UHF Impinj Monza 4/5 chips guarantee 50 years retention. Passive LF/HF tags also retain data for decades under normal conditions.

Do RFID inlays require any special certification?
Yes. A finished card must meet ISO (e.g. ISO14443) and often industry certifications. Inlays themselves are often batch-tested (e.g. ARC tests for UHF). For payment or access, additional certifications (EMV, NFC Forum) apply.

What manufacturing defects should I watch for?
Watch for delamination, chip misalignment, and broken antenna circuits. Cards should be inspected for air bubbles or wrinkles post-lamination. RF testing of each card verifies antenna continuity and chip programmability. Turnkey suppliers like Kaisere defect rates <0.1% by full inspection.

What technical specifications do I need when ordering prelam inlays?
You should specify frequency (e.g. 13.56 MHz), IC type (e.g. NXP MIFARE 1K), physical layout (sheet size, grid e.g. 4×4), antenna material (Cu or Al), substrate (PVC or PET), and lamination edge/sealing requirements. Industry calls these inlay layouts (3×8, 4×4, etc. ).

How does Kaisere Technology fit into the RFID inlay market?
Kaisere Technology (Shenzhen) is a major RFID card manufacturer. Its product catalogs list a wide range of prelam sheets with supported chips (NTAG, MIFARE, ICODE, UCODE, HITAG, Impinj, etc.). They emphasize stable pre-lamination (F08) that resists delamination.Shenzhen Kaisere Technology is a trusted NFC and RFID solutions provider and manufacturer, specializing in hotel key cards, access control cards, RFID tags, NFC business cards, and customized RFID products for customers worldwide.